Chroma ATE to Showcase Semiconductor ValidationEcosystem at SEMICON Taiwan 2026

As AI chips push the boundaries of performance, power density, and packaging complexity, semiconductortest and measurement is no longer limited to quality control at the end of production. Increasingly,validation begins earlier in R&D and extends across process development, reliability verification, and mass-production deployment, making test technology a critical factor in development speed, production yield,and efficiency.

At SEMICON Taiwan 2026, Chroma ATE Inc. will showcase a comprehensive semiconductor validationecosystem built around three core areas: advanced packaging and IC testing, power semiconductorvalidation, and RF and wireless testing. The exhibit will also feature solutions for semiconductor processchemical monitoring and IC reliability validation.

By bringing together measurement, test, and validation technologies across multiple disciplines, Chromahelps customers address challenges from early engineering validation to volume manufacturing,accelerating the commercialization of next-generation semiconductor technologies.

Advanced Packaging and IC Testing

• White-Light Interferometry for Advanced Packaging

Driven by AI and HPC, both wafer-level and panel-level advanced packaging continue to evolve rapidly. Asstructures become ever smaller and more complex, accurate 3D profiling at the micron and nanometerscale has become increasingly critical. Conventional optical measurement, however, can struggle withhigh-aspect-ratio and ultra-fine structures, resulting in insufficient measurement accuracy and datadeviations.

Chroma's 2D/3D Wafer/Panel Measurement System targets critical dimension (CD) measurement for keyadvanced packaging structures, including TSVs, vias, RDLs, and probe marks. The system enables high-speed, nondestructive 3D profile analysis with nanometer-level measurement capability. An integratedquality control monitor (QCM) continuously tracks system status and compensates for environmentalinterference, maintaining exceptional measurement stability during extended operation.

By shortening process implementation and measurement time, improving yield visibility, and reducingcalibration-related downtime, the system provides advanced packaging manufacturers with a strongcompetitive advantage.

• Advanced IC Test Ecosystem — SLT / FT / Burn-In

As IC packages grow larger, more power-hungry, and more complex, testing is no longer simply aboutdetermining pass or fail. Test equipment has an increasingly decisive impact on how quickly products canbe developed, how efficiently they can be manufactured, and how reliably they perform in the field.

Building on extensive expertise in System Level Test (SLT), including high-power thermal control,automated handling, precision contact, and system integration, Chroma has extended these corecapabilities into Final Test (FT) and Burn-In, creating a complete test ecosystem spanning engineeringvalidation through high-throughput mass production.

For SLT, Chroma provides a complete Lab-to-Fab deployment path through the 3210-A engineeringvalidation platform and the modular 3200 multi-station production platform. Customers can first validatetest conditions, contact mechanisms, and thermal management solutions for large, high-power advancedpackaging devices. Once production feasibility has been confirmed, validated conditions can betransferred to the 3200 and flexibly scaled according to product mix, floor space, and capacityrequirements, maximizing testing efficiency within valuable fab space.

For FT, Chroma introduces the new 3210-B and 3160-H advanced test platforms. The 3210-B features anintegrated mobile trolley and labor-saving operating mechanism, allowing rapid deployment to differentlocations according to customer requirements. It supports development of test solutions for large devices,contact conditions, and high-power thermal management. Its thermal control architecture can also beprogressively upgraded according to application requirements, supporting heat dissipation of up to 5 kW.

The 3160-H is designed specifically for mass-production testing of high-power, large-size, and advancedpackaging devices. By combining stable thermal control, intelligent handling, and multiple inspectioncapabilities, it increases test throughput without compromising production quality or operationalreliability.

For Burn-In, Chroma extends its proven Lab-to-Fab and modular design concepts developed for SLT to its3830 and 3832 Burn-In platforms. Through early validation, multi-site configurations, robotic handling,independent test control, and real-time electrical monitoring, test conditions established duringengineering can be progressively replicated and scaled for high-throughput mass production.

From the Lab-to-Fab approach for SLT and high-power FT production capabilities to the new Burn-Inplatforms, Chroma has built a scalable IC test ecosystem designed to grow with both product maturity andproduction demand—helping customers validate earlier, ramp faster, and bring next-generation ICs tomarket with greater confidence.

Power Semiconductor Validation

• High-Voltage Production Testing for GaN and SiC

The rapid development of AI data centers, electric vehicles, and renewable energy is driving GaN and SiCpower devices toward higher voltages and higher-volume production. At 3.3 kV SiC, manufacturers mustovercome several challenges at once: generating sufficient test voltage, accurately measuring extremelysmall leakage currents, minimizing equipment footprint, and avoiding costly reprogramming and hardwarereplacement when upgrading test platforms.

The Chroma 3650-S2C builds on the proven production stability of the 3650-S2 while optimizing theplatform for power semiconductor manufacturing. Its high-voltage power supply is integrated directly intothe test head, eliminating the need for a separate power cabinet and reducing footprint, external cabling,and maintenance complexity. The compact architecture also simplifies integration with turret handlers.

The 3650-S2C is also compatible with existing 3650-S2 cards and test programs, allowing customers tocontinue using existing test assets and reduce the costs associated with equipment upgrades, programmigration, and revalidation.

When equipped with the new HVSMU card, each channel provides a 3 kV floating output, which can bestacked to achieve up to 6 kV, together with 10 nA leakage-current measurement resolution. This fullysupports BVDSS and IDSS testing of 3.3 kV SiC devices.

The solution enables customers to accelerate the introduction of new GaN and SiC products into massproduction with a smaller equipment footprint, lower migration costs, and more comprehensive high-voltage measurement capability.

• Long-Term Insulation Reliability Testing

As EV system voltages continue to rise and demand for high-power AIDC power supplies grows rapidly,semiconductor power devices such as IGBTs and SiC MOSFETs, as well as isolation components, mustwithstand increasingly high voltages and operate for extended periods under high potential differences. Asa result, industry requirements for long-term operating safety and insulation quality are becomingincreasingly stringent.

Notably, partial discharge (PD) caused by microscopic insulation defects inside a device cannot bedetected through conventional withstand voltage testing. Over prolonged operation, these defects cancause insulation degradation, resulting in device burnout or even system failure.

Semiconductormanufacturers therefore face the challenge of simultaneously achieving high quality, high reliability, andhigh throughput during both R&D and production.

To address this challenge, Chroma offers the 19501 Series Partial Discharge Tester, which meets the PDmeasurement requirements of IEC 60270 and incorporates test methods compliant with IEC 60747-5-5 andIEC 60747-17. It supports 0.1–10 kVac withstand voltage testing and partial discharge measurements from1 pC to 6,000 pC.

The Chroma 1950 Isolator Ultra High Voltage Test System can control multiple Chroma 19501 + A195004units to perform multi-channel, phase-synchronized, high-voltage PD testing while collecting, analyzing,and statistically processing test data, providing highly stable testing capability for large-scale production.

PDIV/PDEV analysis helps engineers precisely identify potential insulation risks during the early stages ofR&D, while production testing helps ensure consistent insulation quality in mass-produced devices.Together, these capabilities provide a strong safeguard for the reliability and stability of high-voltagesemiconductor power devices.

RF and Wireless Communication Validation

• 320 MHz Broadband RF Testing

The ADIVIC 35809 Wi-Fi 7 Tester integrates a vector signal generator (VSG) and vector signal analyzer(VSA), providing 320 MHz instantaneous bandwidth and an RF test frequency range from 400 MHz to 8GHz. It helps semiconductor, wireless module, and end-device manufacturers address the increasinglycomplex RF PHY testing requirements of Wi-Fi 7 and multi-standard WLAN products.

With its integrated VSG/VSA and programmable test sequences, the 35809 can serve as a non-signaling RFtest platform for WLAN chipsets, FEM modules, wireless routers, access points, and consumer electronicproducts.

Customers can establish a common test methodology spanning engineering debugging, quality validation,and production-line testing according to each stage of product development, reducing duplicateddevelopment work and the platform transition costs.

SuperSizer — Ultrafine Liquid Chemical Cleanliness Monitoring
Measurement precision beyond the limits of light particle counters, with accurate monitoring of particlesfrom 3 nm to 20 nm in liquid chemicals, is one of our key advantages.

Validated by multiple global wafer manufacturers, SuperSizer has been deployed in Taiwan, the UnitedStates, China, and Singapore and is used across wafer manufacturing, chemical supply, and relatedindustries.

Based on aerosol measurement technology, SuperSizer precisely monitors particles from 3 nm to 64 nmwhile effectively overcoming the susceptibility of conventional optical detection methods to bubbleinterference.

Four generations of products—SuperSizer II, V, VI, and VII—are currently used to measure CMP slurry,isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The newly introducedSuperSizer VIII is designed specifically for hydrochloric acid monitoring.

Through real-time in-line monitoring, SuperSizer helps reduce wafer damage, ensure liquid chemicalquality, and improve process yield. Visit the Chroma booth to learn more about the technology and itssemiconductor process applications.

Reliability Validation for High-Speed Video Transmission ICs

With the rapid adoption of AI-powered smart cockpits, high-resolution displays, and next-generationhuman-machine interfaces, high-speed video transmission ICs have become critical components in automotive electronics, consumer electronics, and industrial display systems.

As data transmission rates increase and application environments become more complex, these ICs mustnot only deliver excellent performance but also maintain stable operation under demanding conditionssuch as prolonged high temperatures and high loads to ensure signal integrity and product reliability.

To help customers address the validation challenges associated with advanced video ICs, Chroma offers acomplete Burn-In test solution, the 27010 Series, supporting major high-speed display interfaces includingLVDS, eDP, and MIPI.

Through MIPI BTA (bus turnaround) bidirectional communication validation, the system accuratelysimulates chip operating conditions in actual applications. Its comprehensive and highly efficient reliabilityvalidation capabilities help customers identify potential failure risks earlier, improve product quality andmass-production yield, and accelerate go-to-market for next-generation smart display and in-vehiclesystems.